Method for manufacturing a non-volatile semiconductor memory device having contact plug formed on silicided source/drain region

ABSTRACT

A method for manufacturing a semiconductor device includes the steps of forming a flash memory cell provided with a floating gate, an intermediate insulating film, and a control gate, forming first and second impurity diffusion regions, thermally oxidizing surfaces of a silicon substrate and the floating gate, etching a tunnel insulating film in a partial region through a window of a resist pattern; forming a metal silicide layer on the first impurity diffusion region in the partial region, forming an interlayer insulating film covering the flash memory cell, and forming, in a first hole of the interlayer insulating film, a conductive plug connected to the metal silicide layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 12/013,709 filed Jan. 14, 2008, which is based on and claimsthe benefits of the priority of Japanese Patent Application No.2007-042924 filed on Feb. 22, 2007, the entire contents of which beingincorporated herein by reference.

TECHNICAL FIELD

It is related to a semiconductor device and a method for manufacturingthe semiconductor device.

BACKGROUND

In a semiconductor device such as an LSI, an impurity diffusion region(e.g., a source/drain region) is formed in a surface layer of asemiconductor substrate, and a thermal oxidation film is formed on theimpurity diffusion region as a gate insulating film. At this time, thegrowth rate of the thermal oxidation film tends to be faster as theimpurity concentration of the impurity diffusion region becomes higher.Such a phenomenon is referred to as accelerating oxidation.

The concentration of the impurity diffusion region formed in thesemiconductor substrate is optimized depending on a role that theimpurity diffusion region plays. Thus, a plurality of impurity diffusionregions in one chip rarely have the same concentration. Normally,concentrations of the impurity diffusion regions are different from oneanother.

However, when the concentrations of the impurity diffusion regions aredifferent from one another, the thermal oxidation film grows thicker inthe impurity diffusion region with a high concentration than in otherportions due to the above-described accelerating oxidation. The thermaloxidation film is needed to be removed by etching before a metalsilicide layer is formed in the surface layer of the impurity diffusionregion. However, when the etching time is adjusted for the thicklyformed thermal oxidation film, the device isolation insulating filmslocated below the thermal oxidation film are also etched in the portionswhere the thermal oxidation film is formed thinly.

For this reason, as shown in Japanese Patent Application Laid-openPublication No. 2003-282740 for example, a problem arises that a leakcurrent increases in edge portions of an active region of a transistor.

In Japanese Patent Application Laid-open Publication No. 2003-282740,for the purpose of avoiding such a problem, a thermal oxidation film iscovered by a silicon nitride film in order to prevent the thermaloxidation film under the silicon nitride film from being acceleratedlyoxidized (see, paragraph 0040).

In addition, in Japanese Patent Application Laid-open Publication No.2002-280464, a substance such as nitrogen having a function to preventaccelerating oxidation is ion-implanted into a semiconductor substrate(see paragraph 0060).

SUMMARY

It is an aspect of the embodiments discussed herein to provide asemiconductor device, including a semiconductor substrate, first andsecond impurity diffusion regions, which are formed at a distance fromeach other in a surface layer of the semiconductor substrate, a thermaloxidation film, which are formed on at least the first and secondimpurity diffusion regions and the semiconductor substrate therebetween,a flash memory cell, which is formed by laminating, a floating gateformed of a first conductive film, an intermediate insulating film, acontrol gate formed of a second conductive film in this order on thethermal oxidation film, and which uses the first and second impuritydiffusion regions as source/drain regions, an interlayer insulatingfilm, which covers the flash memory cell, and which is provided with afirst hole over the first impurity diffusion region, and a firstconductive plug formed in the first hole, wherein the thermal oxidationfilm is removed from a partial region of the first impurity diffusionregion, a metal silicide film is formed on the partial region of thefirst impurity diffusion region, and the metal silicide layer and theconductive plug are connected.

It is another aspect of the embodiments discussed herein to provide amethod for manufacturing a semiconductor device including the steps offorming a thermal oxidation film, a first conductive film, and anintermediate insulating film in this order over a semiconductorsubstrate, forming a second conductive film over the intermediateinsulating film, forming a flash memory cell provided with a floatinggate, the intermediate insulating film, and a control gate, bypatterning the first conductive film, the intermediate insulating film,and the second conductive film, forming first and second impuritydiffusion regions, which are to be source/drain regions of the flashmemory cell, in portions of the semiconductor substrate beside thecontrol gate, thermally oxidizing surfaces of each of the semiconductorsubstrate and the floating gate after the first and second impuritydiffusion regions are formed, forming a resist pattern, provided with awindow over a partial region of the first impurity diffusion region,over the thermal oxidation film and the flash memory cell after thethermal oxidation, removing the thermal oxidation film in the partialregion by etching through the window, removing the resist pattern,forming a metal silicide layer on the partial region of the firstimpurity diffusion region, forming an interlayer insulating filmcovering the flash memory cell, forming a first hole in the interlayerinsulating film over the partial region; and forming a conductive plugconnected to the metal silicide layer in the first hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1V are cross-sectional views of a manufacturingsemiconductor device according to a preliminary explanation;

FIGS. 2A to 2G are plan views of the manufacturing semiconductor deviceaccording to the preliminary explanation;

FIG. 3 is a view in which voltages applied at the time of reading out aflash memory cell are added to an equivalent circuit of thesemiconductor device according to the preliminary explanation;

FIG. 4 is a view in which voltages applied at the time of carrying outwriting to the flash memory cell are added to the equivalent circuit ofthe semiconductor device according to the preliminary explanation;

FIG. 5 is a cross-sectional view for describing disadvantages causedwhen a device isolation insulating film is etched in the preliminaryexplanation; and

FIGS. 6A to 6C are cross-sectional views showing a manufacturingsemiconductor device according to an embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (1) PreliminaryExplanation

Prior to describing the preferred embodiments, preliminary explanationwill be given below.

FIGS. 1A to 1V are cross-sectional views of a manufacturingsemiconductor device according to the preliminary explanation, and FIGS.2A to 2G are plan views thereof.

This semiconductor device is a logic embedded nonvolatile memoryprovided with a flash memory cell and a peripheral transistor. As shownin FIG. 1A, this semiconductor device has a cell region A and aperipheral circuit region B.

To manufacture the semiconductor device, as shown in FIG. 1A, deviceisolation grooves 1 a are firstly formed in a silicon (semiconductor)substrate 1, and a device isolation insulating film 2 formed of siliconoxide film, or the like, is embedded in the divide isolation grooves 1a.

Thereafter, first and second p-wells 3 and 4 are respectively formed inthe cell region A and the peripheral circuit region B.

Note that cross-sectional views in FIG. 1A correspond to those takenalong the I-I, II-II, III-III, and IV-IV lines in the plan view of FIG.2A.

Next, as shown in FIG. 1B, an entire surface of the silicon substrate 1is thermally oxidized by heating it at the substrate temperature ofapproximately 800° C. in an atmosphere containing oxygen. Thereby, atunnel insulating film 5 formed of a thermal oxidation film with thethickness of approximately 9.3 nm is formed.

Next, as shown in FIG. 1C, a doped amorphous silicon film into whichphosphorus as impurities is doped is formed with the thickness ofapproximately 90 nm on the tunnel insulating film 5 by a chemical vapordeposition (CVD) method. The formed amorphous silicon film is used afirst conductive film 8.

Next, as shown in FIG. 1D, a first resist pattern 10 is formed on thefirst conductive film 8. Thereafter, the first conductive film 8 isetched by using this first resist pattern 10 as a mask, so that aplurality of slit-shaped openings 8 x is formed in the first conductivefilm 8 in the cell region A.

After that, the first resist pattern 10 is removed.

FIG. 2B is a plan view after the first resist pattern 10 is removed.

Next, as shown in FIG. 1E, an ONO film is formed as an intermediateinsulating film 12 on each of the first conductive film 8 and the deviceisolation insulating film 2.

As shown in the dotted circle of FIG. 1E, the intermediate insulatingfilm 12 is made by forming a first silicon oxide film 12 a, a siliconnitride film 12 b, and a second silicon oxide film 12 c in this order.

Among these films, the first silicon oxide film 12 a is formed with thethickness of approximately 10 nm on the first conductive film 8 by theCVD method at the substrate temperature of approximately 750° C. Thesilicon nitride film 12 b is formed with the thickness of approximately12 nm by the CVD method.

Then, the second silicon oxide film 12 c in the uppermost layer isformed by thermally-oxidizing a surface layer of the silicon nitridefilm 12 b by heating the surface thereof in the atmosphere containingoxygen at the substrate temperature of approximately 950° C. The targetthickness thereof is set to be 180 nm on a surface of a test siliconsubstrate. However, since the oxidation of silicon nitride is less easythan silicon, the actual thickness of the second thermal oxidation filmbecomes approximately 5 nm.

Here, a metal oxide semiconductor (MOS) transistor for a peripheralcircuit is formed later in the peripheral circuit region B. When the MOStransistor is formed, the intermediate insulating film 12 and the firstconductive film 8 are unnecessary.

For this reason, as shown in FIG. 1F, in the next process, a secondresist pattern 14 is formed on the intermediate insulating film 12 inthe region other than the peripheral circuit region B. After that, theintermediate insulating film 12, the first conductive film 8, and thetunnel insulating film 5 in the peripheral circuit region B are removedby dry etching while this second resist pattern 14 is used as a mask.

This etching is anisotropic etching using a fluorine-based gas or achlorine-based gas as an etching gas.

Thereafter, the second resist pattern 14 is removed.

Next, processes for obtaining a cross-sectional structure shown in FIG.1G will be described.

Firstly, the surface of the silicon substrate 1 in the peripheralcircuit region B is thermally oxidized, so as to form a gate insulatingfilm 15 for a peripheral circuit. The gate insulating film 15 is formedof a thermal oxidation film with the thickness of approximately 7.0 nm.

Subsequently, an amorphous silicon film is formed with the thickness ofapproximately 120 nm on each of the intermediate insulating film 12 andthe gate insulating film 15 by the CVD method. Furthermore, a tungstensilicon film is formed with the thickness of 140 nm on the amorphoussilicon film by the CVD method. A laminated film of these amorphoussilicon film and tungsten silicon film is used as a second conductivefilm 16. Note that a impurity, such as phosphorus, may be doped intoamorphous silicon constituting the second conductive film 16 for apurpose of reducing resistance, at the time when the second conductivefilm 16 is formed.

FIG. 2C is a plan view after the second conductive film 16 is formed inthis manner.

Next, as shown in FIG. 1H, a third resist pattern 18 is formed on thesecond conductive film 16. The planar shape of the third resist pattern18 is stripe in the cell region A. Thereafter, the first conductive film8, the intermediate insulating film 12, and the second conductive film16 in the cell region A are etched by using the third resist pattern 18as a mask.

This etching is anisotropic etching using a fluorine-based gas or achlorine-based gas as an etching gas.

Up to this steps, a flash memory cell FL made by laminating a floatinggate 8 a, an intermediate insulating film 12, and a control gate 16 a inthis order is formed in the cell region A. Among these, the control gate16 a constitutes a part of a word line (WL).

In addition, at the same time when such a flash memory cell FL isformed, a selection transistor TR_(SEL), which is provided with the gateelectrode 8 b functioning as a selection line to be described later, isformed at a distance from the flash memory cell FL.

Similar to the floating gate 8 a, the gate electrode 8 b constitutingthe selection transistor TR_(SEL) is made of the first conductive film8, and the intermediate insulating film 12 and the second conductivefilm 16 remain on the gate electrode 8 b. In addition, the tunnelinsulating film 5 plays a role as a gate insulating film of theselection transistor TR_(SEL).

Thereafter, the third resist pattern 18 is removed.

FIG. 2D is a plan view after the third resist pattern 18 is removed.

As shown in the drawing, the control gate 16 a and the gate electrode 8b are formed in stripes while being parallel with each other.

Next, as shown in FIG. 1I, a fourth resist pattern 20 provided with awindow 20 a over the gate electrode 8 b is formed on the secondconductive film 16.

Subsequently, the second conductive film 16 in the cell region A isetched by using the fourth resist pattern 20 as a mask to remove thesecond conductive film 16 over a contact region CR of the gate electrode8 b. Thereby, an opening 16 c is formed. At the same time, in theperipheral circuit region B, the second conductive film 16 is patternedinto a gate electrode 16 d for a peripheral circuit.

The fourth resist pattern 20 is removed after this etching is finished.

FIG. 2E is a plan view after the fourth resist pattern 20 is removed.

Next, as shown in FIG. 1J, a fifth resist pattern 22 is formed on theentire upper surface of the silicon substrate 1. Both side surfaces ofthe control gate 16 a of the flash memory cell FL is exposed from thefifth resist pattern 22, whereas both side surfaces of the gateelectrode 8 b is covered with the fifth resist pattern 22.

Subsequently, while using this fifth resist pattern 22 as a mask, n-typeimpurities are ion-implanted into the silicon substrate 1 beside thefloating gate 8 a. Thereby, first and second impurity diffusion regions24 a and 24 b to be source/drain regions of the flash memory cell FL areformed at a distance from each other.

This ion implantation is carried out in two steps. In the first step,phosphorus is ion-implanted under conductions with acceleration energyof 30 KeV and a dose amount of 1.0×10¹⁴ cm⁻², and in the following step,arsenic is ion-implanted under conditions with acceleration energy of 25KeV and a dose amount of 6.0×10¹⁵ cm⁻².

Here, since the side surfaces of the gate electrode 8 b is covered withthe fifth resist pattern 22, the second impurity diffusion region 24 bis formed at a distance from the gate electrode 8 b.

Thereafter, the fifth resist pattern 22 is removed.

Next, as shown in FIG. 1K, phosphorus is ion-implanted as n-typeimpurities into the silicon substrate 1, so that first to thirdsource/drain extensions 26 a to 26 c with impurity concentrations lowerthan those of the first and second impurity diffusion regions 24 a and24 b, are formed in the cell region A. The conditions for the ionimplantation are, for example, acceleration energy of 20 KeV and a doseamount of 5.0×10¹³ cm⁻².

Next, as shown in FIG. 1L, the surfaces of the silicon substrate 1 andthe floating gate 8 a are thermally oxidized by heating the surfacesthereof in the atmosphere containing oxygen at the substrate temperatureof 800° C. Thereby, a sacrificial thermal oxidation film is formed withthe thickness of 5 nm on the silicon substrate 1.

As shown in the dotted circle in the drawing, a corner of the floatinggate 8 a facing the silicon substrate 1 is oxidized by forming such asacrificial thermal oxidation film 28. Thus, the thickness of the tunnelinsulating film 5 in the vicinity of the corner increases. As a result,electrons E accumulated in the floating gate 8 a are made difficult toescape towards the substrate 1 along with a path P shown by the arrow inthe dotted circle. Thus, the electrons E can be retained in the floatinggate 8 a for a long time, and retention characteristics of the flashmemory cell FL is improved.

Thereafter, phosphorus is ion-implanted as n-type impurities into thesilicon substrate 1 in the peripheral circuit region B under conditionswith acceleration energy of 20 KeV and a dose amount of 5.0×10¹³ cm⁻².Thereby, a fourth source/drain extension 26 d is formed beside the gateelectrode 16 d for a peripheral circuit.

Here, in portions where the first and second impurity diffusion regions24 a and 24 b are formed in the surface layer of the silicon substrate1, an impurity concentration thereof is higher than that in otherportions. For this reason, an effect of accelerating oxidation at thetime of thermal oxidation is strong. As a result, the thickness of thetunnel insulating film 5 increases in the impurity diffusion regions 24a and 24 b due to this thermal oxidation.

Next, as shown in FIG. 1M, a silicon oxide film is formed with thethickness of approximately 120 nm on the entire upper surface of thesilicon substrate 1 by the CVD method as a sidewall insulating film 30.

Then, as shown in FIG. 1N, this sidewall insulating film 30 is etchedback to be left as insulating sidewalls 30 a beside the floating gate 8and the gate electrode 8 b.

An etching-back amount is set to be such a value that the tunnelinsulating film 5 on the third source/drain extension 26 c and thesidewall insulating film 30 is removed. Accordingly, the tunnelinsulating film 5 which is thickly formed on the first and secondimpurity diffusion regions 24 a and 24 b due to the acceleratingoxidation is not removed by this etching back.

Next, as shown in FIG. 1O, the entire surface of the silicon substrate 1is thermally oxidized again by heating it in the atmosphere containingoxygen at the substrate temperature of 850° C. Thereby, a throughinsulating film 32 formed of a thermal oxidation film is formed with thethickness of approximately 5 nm.

Next, as shown in FIG. 1P, a sixth resist pattern 36 is formed on theentire upper surface of the silicon substrate 1 in a manner that thegate electrode 8 b of the selection transistor TR_(SEL) and the gateelectrode 16 d for a peripheral circuit expose. Then, while this sixthresist pattern 36 is used as a mask, n-type impurities are ion-implantedinto the silicon substrate 1 through the through insulating film 32.

With this, third and fourth impurity diffusion regions 24 c and 24 d,which function as source/drain regions of the n-type selectiontransistor TR_(SEL), are formed in the silicon substrate 1 beside thegate electrode 8 b. Note that both of the impurity concentration of thethird and fourth impurity diffusion regions 24 c and 24 d is lower thanboth of the impurity concentration of the first and second impuritydiffusion regions 24 a and 24 b. Furthermore, third impurity diffusionregions 24 c is formed adjacent to the second impurity diffusion regions24 b as shown in the drawing.

At the same time, fifth and sixth impurity diffusion regions 24 e and 24f, which function as source/drain regions of the transistor for aperipheral circuit, are also formed in the silicon substrate 1 besidethe gate electrode 16 d for a peripheral circuit. As a result, an n-typeperipheral transistor TR_(PERI) formed of the impurity diffusion regions24 e and 24 f, the gate electrode 16 d, and the like, is formed in theperipheral circuit region B.

Although the conditions for this ion implantation are not particularlylimited, acceleration energy of 30 KeV and a dose amount of 1.0×10¹⁵cm⁻² are used in the present embodiment.

Thereafter, the sixth resist pattern 36 is removed.

Next, as shown in FIG. 1Q, a photoresist is coated on the entire uppersurface of the silicon substrate 1. Then, the photoresist is exposed anddeveloped to form a seventh resist pattern 39.

The seventh resist pattern 39 has a window 39 a in the contract regionCR of the gate electrode 8 b of the selection transistor TR_(SEL).

Thereafter, the intermediate insulating film 12 is removed by etchingthrough the window 39 a to expose the contact region CR of the gateelectrode 8 b. This etching is anisotropic etching using afluorine-based gas as an etching gas.

Thereafter, the seventh resist pattern 39 is removed.

Then, as shown in FIG. 1R, the through insulating film 32 is removed bywet etching.

Next, processes for obtaining a cross-sectional structure shown in FIG.1S will be described.

Firstly, a titanium film is formed with the thickness of approximately31.5 nm on the entire upper surface of the silicon substrate 1 by thesputtering method as a refractory metal layer.

Subsequently, annealing is carried out on the refractory metal film inthe nitrogen atmosphere under conditions with the substrate temperatureof 700° C. and a processing time of approximately 90 seconds. With this,silicon contained in the control gate 16 a and the silicon substrate 1reacts with a refractory metal to form a metal silicide layer 40 made oftitanium silicide.

Thereafter, the refractory metal film remaining unreacted on the deviceisolation insulating film 2 and the insulating sidewall 30 a is removedby wet etching.

Then, the metal silicide layer 40 is annealed again in an argonatmosphere to lower the resistance of the metal silicide layer 40. Theannealing is carried out, for example, at the substrate temperature of800° C. for 30 seconds.

Here, as described above, the tunnel insulating film 5 is thickly lefton the first and second impurity diffusion regions 24 a and 24 b due tothe accelerating oxidation. Therefore, the tunnel insulating film 5 onthe first and second impurity diffusion regions 24 a and 24 b preventsthe reaction of silicon with the refractory metal film, so that themetal silicide layer 40 is not formed on the first and second impuritydiffusion regions 24 a and 24 b.

Next, processes for obtaining a cross-sectional structure shown in FIG.1T will be described.

Firstly, a silicon oxide film is formed with the thickness ofapproximately 100 nm on the entire upper surface of the siliconsubstrate 1 by the plasma CVD method as a cover insulating film 42.

Subsequently, a boro-phospho-silicate-glass (BPSG) film is formed withthe thickness of 1700 nm on the cover insulating film 42 by the CVDmethod. This BPSG film is used as a first interlayer insulating film 43.

Thereafter, the upper surface of the first interlayer insulating film 43is planarized by the CMP method, and then the first interlayerinsulating film 43 and the cover insulating film 42 are patterned. Withthis, first holes 43 a are formed in these insulating films over thefirst and fourth impurity diffusion regions 24 a and 24 d. In addition,a second hole 43 b is formed in the insulating films 42 and 43 over thecontact region CR of the gate electrode 8 b, and third holes 43 c areformed over the fifth and sixth impurity diffusion regions 24 e and 24 fin the peripheral region B.

Then, a titanium film and a titanium nitride film are formed in thisorder as a glue film on the inner surfaces of the first to third holes43 a to 43 c and on the upper surface of the first interlayer insulatingfilm 43 by the sputtering method. Furthermore, a tungsten film is formedon this glue film by the CVD method to completely embed the holes 43 ato 43 c with the tungsten film.

After that, the excessive glue film and tungsten film on the firstinterlayer insulating film 43 are removed, and these films are left onlyin the first to third holes 43 a to 43 c as first to third conductiveplugs 44 a to 44 c.

Among these plugs, the first conductive plugs 44 a are electricallyconnected to the first and fourth impurity diffusion regions 24 a and 24d. In addition, the second conductive plug 44 b is connected to themetal silicide layer 40 in the contact region CR of the gate electrode 8b, and is electrically connected to the gate electrode 8 b through thismetal silicide layer 40. Then, the third conductive plugs 44 c areelectrically connected to the fifth and sixth impurity diffusion regions24 e and 24 f.

FIG. 2F is a plan view after the conductive plugs 44 a to 44 c areformed as described above.

Next, as shown in FIG. 1U, a metal laminated film is formed on the firstinterlayer insulating film 43 by the sputtering method. The metallaminated film is then patterned into a source line (SL) 46 a, aselection line backing layer 46 b, a bid line contact pad 46 c, and awiring 46 d for a peripheral circuit. The metal laminated film is formedby laminating, for example, a titanium nitride film, a titanium film, acopper-containing aluminum film, and a titanium nitride film in thisorder.

Subsequently, as shown in FIG. 1V, a silicon oxide film is formed as asecond interlayer insulating film 48 on the entire upper surface of thesilicon substrate 1. Then, the upper surface of the second interlayerinsulating film 48 is polished and planarized by the CMP method.

Furthermore, the second interlayer insulating film 48 is patterned toform a fourth hole 48 a on the bit line contact pad 46 c. A fifthconductive plug 50, which is electrically connected to the bid linecontact pad 46 c, is embedded in the fourth hole 48 a by a methodsimilar to that of the first to third conductive plugs 44 a to 44 c.

After that, a metal laminated film is formed on each of the uppersurfaces of the fifth conductive plug 50 and the second interlayerinsulating film 48 by the sputtering method. The metal laminated film isthen patterned into bit lines (BL) 52.

FIG. 2G is a plan view after this process is finished.

With this, a basic structure of the semiconductor device is completed.

FIG. 3 is a view in which voltages applied at the time of reading outthe flash memory cell FL are added to an equivalent circuit diagram ofthe semiconductor device.

As shown in the diagram, at the time of readout, a voltage of +3 V isapplied to the selection line (the gate electrode) 8 b to set theselection transistor TR_(SEL) in an ON state. In addition, while avoltage of +1.4 V is applied to the word line (the control gate) 16 a, abias voltage (0.8 V) of the bit line 52 is applied to the source region(the second impurity diffusion region) 24 b of the flash memory cell FL.Note that the source line 46 a is set to be a ground potential.

Thereafter, it is determined, by an unillustrated sense circuit, whetheror not a current flows between the drain region (the first impuritydiffusion region) 24 a and the source region (the second impuritydiffusion region) 24 b of the flash memory FL, so that it is read outwhether or not information (holes) is written in the floating gate 8 aof the flash memory cell FL.

In contrast, FIG. 4 is a view in which voltages applied at the time ofcarrying out writing to the flash memory cell FL is added to theabove-described equivalent circuit diagram.

As shown in the diagram, at the time of writing, the selection line 8 bis set to be a ground potential to set the selection transistor TR_(SEL)in an OFF state, and the bit line 52 is set to be a floating potential.Furthermore, a positive voltage of +6.25 V is applied to the source line46 a, and a negative voltage of −6.25 V is applied to the control gate16 a, so that holes (information) are accumulated in the floating gate 8a.

Here, in the semiconductor device having such an equivalent circuitstructure as described above, if impurity concentrations of thesource/drain regions of each of the flash memory cell FL and theselection transistor TR_(SEL) were set to be equal, the followingdisadvantages would be caused.

Firstly, with regard to the flash memory cell FL, impurityconcentrations of the source/drain regions (the first and secondimpurity diffusion regions) 24 a and 24 b becomes lower than thatnecessary for facilitating the wiring operation. Thus, it becomesdifficult to perform the wiring operation to the flash memory cell FL.

With regard to the selection transistor TR_(SEL), impurityconcentrations of the source/drain regions (the third and fourthimpurity diffusion regions) 24 c and 24 c becomes undesirably increases,which in turn makes the gradient of a p-n junction at the interfacebetween the p-type first well 3 and the regions 24 c and 24 d steeper.Thus, junction leak increases between the substrate and the source/drainregions.

To avoid such disadvantages, in a semiconductor device of this type, theimpurity concentrations of the first and second impurity diffusionregions 24 a and 24 b, which serve as the source/drain regions of theflash memory cell FL, are set to be higher than those of the third andfourth impurity diffusion regions 24 c and 24 d, which serves as thesource/drain regions of the selection transistor TR_(SEL).

However, when the regions 24 a to 24 d with different impurityconcentrations are present in the surface layer of the silicon substrate1 in this manner, the tunnel insulating film 5 grows thickly on thefirst impurity diffusion region 24 a with the high impurityconcentration due to the accelerating oxidation, in the step (FIG. 1L)of thermal oxidation for increasing the retention characteristics.

The sacrificial thermal oxidation film 28 is left on the first impuritydiffusion region 24 a even after the etching steps of FIGS. 1N and 1Rare carried out, which, as a consequence, prevents the formation of themetal silicide layer 40 (see, FIG. 1S) as described above.

As a result, the first conductive plug 44 a on the first impuritydiffusion region 24 a (see, FIG. 1T) comes in direct contact with thefirst impurity diffusion region 24 a without having the metal silicidelayer 40 therebetween. For this reason, a problem arises that contactresistance of the first conductive plug 44 a increases.

To avoid such a problem, it is possibly considered that in the etchingsteps of FIGS. 1N and 1R, the etching-back is further carried out untilthe tunnel insulating film 5 on the first impurity diffusion region 24 ais removed.

FIG. 5 is an enlarged cross-sectional view of an essential portion inthe vicinity of the selection transistor TR_(SEL) in the case where suchan etching is carried out. Note that this cross-sectional viewcorresponds to that taken along the V-V line in FIG. 2F. As shown in thedrawing, when the etching-back is carried out so that the thicksacrificial thermal oxidation film 28 on the first impurity diffusionregion 24 a is removed, the device isolation insulating film 2 besidethe selection transistor TR_(SEL) is also etched. As a result, the uppersurface of the device isolation insulating film 2 becomes lower than thefourth impurity diffusion region 24 d.

When the device isolation insulating film 2 has such a low uppersurface, the metal silicide layer 40 is also formed in the deviceisolation groove 1 a. As a result, such an another problem arises thatthe first conductive plug 44 a on the fourth impurity diffusion region24 d and the first p-well 3 cause an electrical short circuit due to themetal silicide layer 40.

In view of the forgoing description, the inventor of the presentapplication comes up with the following embodiments.

(2) Description of the Present Embodiment

FIGS. 6A to 6C are cross-sectional views of a semiconductor deviceaccording to the present embodiment in the course of manufacturing.

In order to manufacture this semiconductor device, the above-describedprocesses of FIGS. 1A to 1P are firstly carried out.

Next, as shown in FIG. 6A, the seventh resist pattern 39 described inFIG. 1Q is formed on each of the tunnel insulating film 5 and the flashmemory cell FL.

The seventh resist pattern 39 has a window 39 a over the contact regionCR of the gate electrode 8 b, and has a window 39 b over a partialregion PR of the first impurity diffusion region 24 a.

After that, in the partial region PR of the first impurity diffusionregion 24 a, the tunnel insulating film 5, which is thickly formed dueto the accelerating oxidation as described above, is removed by etchingthrough the window 39 b. At the same time, the intermediate insulatingfilm 12 is removed by etching through the window 39 a over the contactregion CR of the gate electrode 8 b.

As described by referring to FIG. 1Q, this etching is anisotropicetching using a fluorine-based gas as an etching gas.

Note that the window 39 b of the seventh resist pattern 39 is displacedfrom the insulating sidewall 30 a beside the floating gate 8 a.Accordingly, the tunnel insulating film 5 between the insulatingsidewall 30 a and the partial region PR is covered by the seventh resistpattern 39, and is left without being etched.

The seventh resist pattern 39 is removed after this etching is finished.

Next, as shown in FIG. 6B, by carrying out the same processes as thoseof FIGS. 1R and 1S, a metal silicide layer 40 made of titanium silicideis formed on the first to sixth impurity diffusion regions 24 a to 24 f.

Here, since the tunnel insulating film 5 in the partial region PR of thefirst impurity diffusion region 24 a is removed in the previous step,the above-described metal silicide layer 40 is also formed in thepartial region PR.

Thereafter, a basic structure of the semiconductor device according tothe present embodiment as shown in FIG. 6C is completed by carrying outthe above-described processes of FIGS. 1T to 1V.

A method for reading out and writing information to the flash memorycell FL provided in the semiconductor device is similar to thatdescribed in FIGS. 3 and 4, and hence, the description thereof will beomitted.

According to the above-described present embodiment, the tunnelinsulating film 5, which is thickly formed in the partial region PR ofthe first impurity diffusion region 24 a due to the acceleratingoxidation, is removed in the step of FIG. 6A. Thus, the metal silicidelayer 40 can be also formed in the partial region PR.

Hence, the first plug 44 a (see, FIG. 6C) over the first impuritydiffusion region 24 a is connected to the metal silicide layer 40, sothat the contact resistance of the first conductive plug 44 a can belowered.

Such an advantage can be particularly easily obtained in the case, as inthe present embodiment, where the first to fourth impurity diffusionregions 24 a to 24 d with different impurity concentrations are formed.In this case, the tunnel insulating film 5 has different filmthicknesses on the first to fourth impurity diffusion regions 24 a to 24d by carrying out the step of thermal oxidation (FIG. 1L) for improvingthe retention characteristics as described above.

Furthermore, as described above, the step (FIG. 6A) of removing theunnecessary intermediate insulating film 12 in the contact region CR ofthe gate electrode 8 b plays the role of removing the tunnel insulatingfilm 5 in the partial region PR. Therefore, an increase in the number ofprocesses can be avoided.

The foregoing is considered as illustrative only of the principles ofthe present invention. Further, since numerous modifications and changeswill readily occur to those skilled in the art, it is not desired tolimit the invention to the exact construction and applications shown anddescribed, and accordingly, all suitable modifications and equivalentsmay be regarded as falling within the scope of the invention in theappended claims and their equivalents.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, comprising: forming a tunnel insulation film on a semiconductorsubstrate; forming a first conductive film on the tunnel insulationfilm; forming an intermediate insulating film on the first conductivefilm; forming a second conductive film over the intermediate insulatingfilm; patterning the first conductive film, the intermediate insulatingfilm and the second conductive film to form a floating gate and controlgate of a flash memory cell in a first region and to form a first gateelectrode of a MOS transistor on a part of the tunnel insulation film ina second region; forming a first impurity diffusion region and a secondimpurity diffusion region, that is located between the flash memory celland the first gate electrode in a plan view, as source/drain regions ofthe flash memory cell in the first region; thermally oxidizing surfacesof each of the semiconductor substrate and the floating gate afterforming the first impurity diffusion region and the second impuritydiffusion region, a thickness of the tunnel insulation film in the firstregion being larger than a thickness of the tunnel insulation film inthe second region after thermally oxidizing; removing the tunnelinsulation film located on a partial region of the first impuritydiffusion region after thermally oxidizing; forming a first metalsilicide layer on the partial region of the first impurity diffusionregion; forming an interlayer insulating film covering the flash memorycell and the MOS transistor; forming a first hole in the interlayerinsulating film over the partial region; and forming a conductive plugconnected to the first metal silicide layer in the first hole.
 2. Themethod for manufacturing a semiconductor device according to claim 1,further comprising: forming a third impurity diffusion region and afourth impurity diffusion region in the second region after thermallyoxidizing, as source/drain regions of the MOS transistor, wherein thesecond impurity diffusion region and third impurity diffusion region areadjacently formed.
 3. The method for manufacturing a semiconductordevice according to claim 2, wherein the first impurity diffusionregion, the second impurity diffusion region, the third impuritydiffusion region and fourth impurity diffusion region have the sameconductive type, and the MOS transistor is made to function as aselection transistor for the flash memory cell.
 4. The method formanufacturing a semiconductor device according to claim 2, furthercomprising: removing the second conductive film over a contact region ofthe first conductive film of the first gate electrode, wherein, inremoving the tunnel insulation film in the partial region, theintermediate insulating film in the contact region is removed byetching, in forming the first metal silicide layer, a second metalsilicide layer is formed on an upper surface of the first conductivefilm of the first gate electrode in the contact region, in forming thefirst hole in the interlayer insulating film, a second hole is formed inthe interlayer insulating film in the contact region, and in forming thefirst conductive plug, a second conductive plug connected to the secondmetal silicide layer is formed in the second hole.
 5. The method formanufacturing a semiconductor device according to claim 4, furthercomprising: removing the tunnel insulation film, the first conductivefilm, and the intermediate insulating film in a peripheral circuitregion of the semiconductor substrate, before forming the secondconductive film; and forming a gate insulating film on an upper surfaceof the semiconductor substrate in the peripheral circuit region afterremoving the tunnel insulation film in the peripheral circuit region,wherein, in forming the second conductive film, the second conductivefilm is formed on the gate insulating film in the peripheral circuitregion, and, in removing the second conductive film over the contactregion, a second gate electrode is formed in the peripheral circuitregion on the gate insulating film.
 6. The method for manufacturing asemiconductor device according to claim 1, further comprising: formingan insulating sidewall on a side surface of the floating gate, whereinin removing the tunnel insulation film, the insulating sidewall locatedbetween the partial region of the first impurity diffusion region andthe insulating sidewall is left.
 7. The method for manufacturing asemiconductor device according to claim 1, wherein the intermediate filmincludes a first silicon oxide film, a silicon nitride film on the firstsilicon oxide film and a second silicon oxide film on the siliconnitride film.
 8. The method for manufacturing a semiconductor deviceaccording to claim 1, wherein the first conductive film includespolysilicon, and the second conductive film includes polysilicon.
 9. Themethod for manufacturing a semiconductor device according to claim 1,further comprising forming a resist pattern that covers the secondregion and the tunnel insulation film located on the second impuritydiffusion region, and that includes a first window located over thepartial region of the first impurity diffusion region, wherein inremoving the tunnel insulation film, the tunnel insulation film locatedon the second diffusion layer is left, and in forming a first metalsilicide layer, the tunnel insulation film located on the seconddiffusion layer is left.
 10. The method for manufacturing asemiconductor device according to claim 2, further comprising: removingthe tunnel insulation film located on the third impurity diffusionregion and the fourth diffusion region with the tunnel insulation filmlocated on the second impurity diffusion region left after removing thetunnel insulation film located on the partial region and before formingthe first metal silicide layer, wherein in forming the first metalsilicide layer, a third metal silicide layer is formed on the thirdimpurity diffusion region and the fourth impurity diffusion region. 11.The method for manufacturing a semiconductor device according to claim1, further comprising forming an extension region in the semiconductorsubstrate between the floating gate and the first gate electrode in aplan view before thermally oxidizing.
 12. The method for manufacturing asemiconductor device according to claim 9, wherein the resist patternincludes a second window located over a contact region of the firstconductive film of the first gate electrode.